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PHOTOCOUPLER
PS8103
HIGH-SPEED (200 kbps) ANALOG OUTPUT TYPE 5-PIN SOP PHOTOCOUPLER
-NEPOC Series-
DESCRIPTION
The PS8103 is an optically coupled isolator containing a GaAs LED on the light emitting diode (input side) and a PIN photodiode and a high-speed amplifier transistor on the output side on one chip. This is a plastic SOP (Small Out-line Package) type for high density applications.
FEATURES
* Wide operating VCC range (VCC = -0.5 to +15 V) * Small package (5-pin SOP) * High isolation voltage (BV = 2 500 Vr.m.s.) * High-speed response (tPHL, tPLH = 5 s MAX. (@RL = 4.1 k)) * Ordering number of taping product: PS8103-F3, F4: 2 500 pcs/reel * Pb-Free product * Safety standards * UL approved: File No. E72422
1 2
PIN CONNECTION (Top View)
5 4 3 1. Anode 2. Cathode 3. GND 4. VO 5. VCC
APPLICATIONS
* Computer and peripheral manufactures * General purpose inverter * Substitutions for relays and pulse transformers * Power supply
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information.
Document No. PN10261EJ02V0DS (2nd edition) Date Published February 2005 CP(K) Printed in Japan
The mark
shows major revised points.
(c) NEC Compound Semiconductor Devices, Ltd. 2003, 2005
PS8103
PACKAGE DIMENSIONS (UNIT: mm)
3.4 +0.3 -0.1
7.00.3 4.4
2.60.2
0.15 +0.10 -0.05
0.10.1
1.27 0.4 +0.10 -0.05 0.25 M
0.50.3
MARKING
8103 N234
No. 1 pin Mark Initial of NEC (Engraved mark)
N
Assembly Lot *1
N
2 34
Week Assembled Year Assembled (Last 1 Digit) Rank Code
*1
Bar : Pb-Free
2
Data Sheet PN10261EJ02V0DS
PS8103
ORDERING INFORMATION
Part Number Order Number Solder Plating Specification PS8103 PS8103-F3 PS8103-F4 PS8103-A PS8103-F3-A PS8103-F4-A Pb-Free
*2
Packing Style
Safety Standard Approval
Application Part Number PS8103
*1
Magazine case 100 pcs Embossed Tape 2 500 pcs/reel
Standard products (UL approved)
*1 For the application of the Safety Standard, following part number should be used. *2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office.
ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified)
Parameter Diode Forward Current Reverse Voltage Power Dissipation
Detector
*1
Symbol IF VR PD VCC VO IO
*2
Ratings 50 5 50 -0.5 to +15 -0.5 to +15 8 80 2 500 -40 to +100 -55 to +125
Unit mA V mW V V mA mW Vr.m.s. C C
Supply Voltage Output Voltage Output Current Power Dissipation
PC BV TA Tstg
Isolation Voltage
*3
Operating Ambient Temperature Storage Temperature
*1 Reduced to 0.5 mW/C at TA = 25C or more. *2 Applies to output pin VO. Reduced to 0.8 mW/C at TA = 25C or more. *3 AC voltage for 1 minute at TA = 25C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together.
Data Sheet PN10261EJ02V0DS
3
PS8103
ELECTRICAL CHARACTERISTICS (TA = 25C)
Parameter Diode Forward Voltage Reverse Current Terminal Capacitance Detector High Level Output Current High Level Output Current Low Level Output Voltage High Level Supply Current Low Level Supply Current Coupled Current Transfer Ratio (IC/IF)
*1 11
Symbol VF IR Ct IOH (1) IOH (2) VOL ICCH ICCL CTR IF = 16 mA VR = 3 V
Conditions
MIN.
TYP. 1.2
MAX. 1.5 10
Unit V
A
pF
V = 0 V, f = 1 MHz IF = 0 mA, VCC = VO = 5.5 V IF = 0 mA, VCC = VO = 15 V IF = 16 mA, VCC = 4.5 V, IOL = 1.1 mA IF = 0 mA, VO = open, VCC = 15 V IF = 16 mA, VO = open, VCC = 15 V IF = 16 mA, VCC = 4.5 V, VO = 0.4 V 10
30 7 500 100 0.1 0.01 150 23 0.4 1 800 30
nA
A
V
A
%
Isolation Resistance Isolation Capacitance Propagation Delay Time (H L) (L H) (H L) (L H)
*2
RI-O CI-O tPHL
VI-O = 1 kVDC, RH = 40 to 60% V = 0 V, f = 1 MHz IF = 16 mA, VCC = 5 V, RL = 4.1 k, CL = 15 pF
10
0.4 1 5
pF
s
Propagation Delay Time
*2
tPLH
2
5
Propagation Delay Time
*2
tPHL
IF = 16 mA, VCC = 5 V, RL = 20 k, CL = 15 pF
1
15
Propagation Delay Time
*2
tPLH
7
15
*1 CTR rank L : 15 to 30 (%) N : 10 to 30 (%) *2 Test circuit for propagation delay time
Pulse input (IF) (Pulse width = 100 s, Duty cycle = 1/10) Input (Monitor) 47
tPHL
tPLH
0.1 F
VCC = 5 V RL = 4.1/20 k VO (Monitor) CL = 15 pF
Input
50% 5V
Output 1.5 V VOL
CL includes probe and stray wiring capacitance.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. By-pass capacitor of 0.1 F is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. Avoid storage at a high temperature and high humidity.
4
Data Sheet PN10261EJ02V0DS
PS8103
TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified)
DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE
120 100 80 60 40 20
60
Diode Power Dissipation PD (mW)
50 40 30 20 10
0
25
50
75
100
0
25
50
75
100
Ambient Temperature TA (C)
Ambient Temperature TA (C)
FORWARD CURRENT vs. FORWARD VOLTAGE
100 1 000
High Level Output Current IOH (nA)
HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE
IF = 0 mA
Forward Current IF (mA)
10
TA = +100C +50C +25C
100 VCC = VO = 15 V 5.5 V 10
1 0C -25C
0.1
1
0.01 0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.1 -25
0
25
50
75
100
Forward Voltage VF (V)
Ambient Temperature TA (C)
CURRENT TRANSFER RATIO vs. FORWARD CURRENT
Current Transfer Ratio CTR (%)
NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE
Normalized Current Transfer Raio CTR
40 35 30 25 20 15 10 5 0 0.5 1 5 10
VCC = 4.5 V, VO = 0.4 V
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 -25 0 25 50 75 100 Normalized to 1.0 at TA = 25C, IF = 16 mA, VCC = 4.5 V, VO = 0.4 V
50
Forward Current IF (mA)
Ambient Temperature TA (C)
Remark The graphs indicate nominal characteristics.
Data Sheet PN10261EJ02V0DS
5
PS8103
OUTPUT CURRENT vs. OUTPUT VOLTAGE
10 IF = 25 mA 20 mA 6 15 mA 4 10 mA 5 mA
Output Voltage VO (V)
OUTPUT VOLTAGE vs. FORWARD CURRENT
6 5 4 3 2 1
Output Current IO (mA)
8
RL = 4.1 k 20 k
2
0
2
4
6
8
10 12 14
16 18
20
0
2
4
6
8
10 12
14
16 18
20
Output Voltage VO (V)
Forward Current IF (mA)
PROPAGATION DELAY TIME vs. FORWARD CURRENT
VCC = 5 V
Propagation Delay Time tPHL, tPLH (s) Propagation Delay Time tPHL, tPLH (s)
PROPAGATION DELAY TIME vs. LOAD RESISTANCE
10 VCC = 5 V, IF = 16 mA tPLH
15
10
tPLH (RL = 20 k)
1 tPHL
5
tPHL (RL = 4.1 k) tPHL (RL = 20 k) tPLH (RL = 4.1 k)
0
5
10
15
20
25
0.1
1
10 Load Resistance RL (k)
100
Forward Current IF (mA)
Normalized Propagation Delay Time tPHL, tPLH
NORMALIZED PROPAGATION DELAY TIME vs. AMBIENT TEMPERATURE
3.0 2.5 2.0 1.5 1.0 0.5 0 -50 Normalized to 1.0 at TA = 25C, IF = 16 mA, VCC = 5 V, RL = 2.2 k, 20 k
tPLH tPHL
-25
0
25
50
75
100
Ambient Temperature TA (C)
Remark The graphs indicate nominal characteristics.
6
Data Sheet PN10261EJ02V0DS
PS8103
TAPING SPECIFICATIONS (UNIT: mm)
Outline and Dimensions (Tape)
1.750.1
7.40.1
2.00.05 4.00.1
1.5+0.1 -0
3.45 MAX.
1.550.1
12.00.2
5.50.1
3.90.1 8.00.1
3.00.1
0.30.05
Tape Direction
PS8103-F3
PS8103-F4
Outline and Dimensions (Reel)
2.00.5
2.00.5 13.00.2
R 1.0
21.00.8
3302.0
13.00.2
1001.0
13.51.0 17.51.0
Packing: 2 500 pcs/reel
11.9 to 15.4 Outer edge of flange
Data Sheet PN10261EJ02V0DS
7
PS8103
NOTES ON HANDLING 1. Recommended soldering conditions
(1) Infrared reflow soldering * Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 12030 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s
260C MAX. 220C
to 60 s
180C
120C
12030 s (preheating)
Time (s)
(2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron * Peak Temperature (lead part temperature) * Time (each pins) * Flux 350C or below 3 seconds or less Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100C
8
Data Sheet PN10261EJ02V0DS
PS8103
(4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler's input and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
USAGE CAUTIONS
1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity.
Data Sheet PN10261EJ02V0DS
9
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Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information.
Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
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